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 1-Day Course on
YIELD IMPROVEMENT FOR FOL PROCESSES
(ASSEMBLY SEMICONDUCTOR)
HRD Corp Claimable


​Venue:
WISMA IEM, PETALING JAYA

​Dates: 
 15 December 2026
​
Time:
9.00 AM to 5.00 PM

Trainer:
IR. TS. DR HO KOK HOE

​HRD Corp Claimable:
​Approved Duration: APPLYING
HRD Corp Serial No: APPLYING

​Fee: 
IEM Member Fee - RM 864.00
Public Registration Fee -  RM 1,080.00
(Kindly take note that the price is inclusive of SST 8%)
​
​Organised by:
IEM Training Academy Sdn Bhd
(Wholly-owned by The Institution of Engineers Malaysia)

OVERVIEW

SYNOPSIS
The performance and effectiveness of electronic devices are being constantly improved by the assembly semiconductor industry. The front of line (FOL) operations of semiconductor assembly yield improvement is one of the primary strategies for achieving this goal. Increased production of functioning devices using a specific manufacturing method is referred to as yield improvement. This is essential for driving down costs and raising revenue in the semiconductor assembly sector. The Mounting, Sawing, Die Attach, and Wire Bonding FOL procedures are essential to the productive assembly of semiconductors.
​
OBJECTIVE
  • Learn the concept of yield improvement
  • Understand the working mechanism of yield improvement (including line sustaining)
  • Correlate the relationship of other tools such as process control, control plan, statistical process control, process variation and process capability with yield analysis
  • Able to develop yield improvement activity based on root cause analysis and improvement plan
  • Knowing the difference between yield improvement, low yield and 8D (customer returned defective product)
  • Identify the challenges in working on yield improvement activity

TARGET AUDIENCE
Managers, Executive, Officers, Engineers and Production/QA Supervisors
TRAINER'S PROFILE
​IR. TS. DR HO KOK HOE
Ho Kok Hoe is a senior lecturer (practice) in the School of Engineering (Electrical and Robotics Engineering department) at Monash University Malaysia. He obtained his PhD in Engineering (Industrial Engineering, Operations Research and Manufacturing) from UTAR on 21 August 2021. He has more than 17 years of industrial experience in process engineering skills (Polymer and Assembly Semiconductor) and he managed processes such as injection moulding, printing, hot stamping, reflow oven, mounting, sawing, die-attach, oven cure, wire bond, gel coating, and lid attach including MEMS product technology operations.

COURSE CONTENT
  • Basic Introduction to Yield
  • Preparing Yield Report
  • Preparing Pareto Chart
  • Yield Analysis on Defects (Root Cause) and Provide Improvement Plan (Action)
  • Process Control, Control Plan, Statistic Process Control, Process Capability on Yield Control
  • Defect Detection - In line (at process) and after process (at Inspection)
  • Sample Case Study - Working on Yield Improvement Plan

    Registration
Terms & Conditions: 
 
  • Closing date: one week before the event
  • Payment via CASH / CHEQUE / BANK-IN TRANSMISSION / WALK-IN
  • FULL PAYMENT must be settled before commencement of the course, otherwise participants will not be allowed to enter the hall. If a place is reserved and the intended participants fail to attend the course, the fee is to be settled in full.
  • Fee paid is not refundable. Registration fee includes lecture notes and refreshment.
  • IEM Training Academy Sdn Bhd (IEMTA) reserves the right to cancel, alter, or change the program due to unforeseen circumstances. Every effort will be made to inform the registered participants of any changes. In view of the limited places available, intending participants are advised to send their registrations as early as possible so as to avoid disappointment.
  • Please be informed that the course will only be carried out if there is sufficient number of participants. The confirmation or cancellation email will be sent to the registered email address one or two weeks before the event dates.
 
Cancellation Policy
 
IEMTA reserves the right to postpone, reschedule, allocate or cancel the course. Full refund less 30% if cancellation is received in writing more than 7 days before the start of the event. No cancellation will be accepted prior to the date of the event. However, replacement or substitute may be made at any time with prior notification and substitute will be charged according to membership status.
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