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2-DAY COURSE ON
SPC Implementation and Process Control in Semiconductor Assembly: Focus on Wire Bond, Sawing and Die Attach
HRD Corp Claimable

​
​Venue:
WISMA IEM, PETALING JAYA

​Dates: 
 28 - 29 September 2026 
​
Time:
9.00 AM to 5.00 PM

Trainer:
Ir Ts Ho Kok Hoe
​
​HRD Corp Claimable:
​Approved Duration: APPLYING
HRD Corp Serial No: APPLYING

​Registration Fee: 
IEM Member Fee- RM 1,620.00
Public Registration Fee -  RM 1,890.00
(Kindly take note that the price is inclusive of SST 8%)

​Organised by:
IEM Training Academy Sdn Bhd
(Wholly-owned by The Institution of Engineers Malaysia)

Click to download flyers

OVERVIEW

SYNOPSIS

This intensive 2-day training program equips participants with practical knowledge and hands-on experience in applying Statistical Process Control (SPC) to semiconductor assembly processes, especially Wire Bond, Sawing, and Die Attach. Participants will learn to set up SPC charts for new processes, monitor and interpret SPC data during production and solve real-life SPC issues to ensure yield stability and process optimization.

OBJECTIVES
By the end of this training participants will be able to:

• Understand the fundamentals and purpose of SPC in semiconductor manufacturing
• Identify and monitor key parameters in Wire Bond, Sawing and Die Attach
• Set up new SPC chart (X-bar, R, Individual, Attribute chart) with real data
• Calculate control limits and identify trends, shifts and out-of-control situations
• Apply root cause analysis and problem-solving tools to resolve SPC violations
• Develop practical skills in data interpretation and correction action planning
• Connect SPC monitoring with process stability, tool life and yield improvement

TRAINER'S PROFILE

Ir Ts Ho Kok Hoe is a senior lecturer (practice) in the School of Engineering (Electrical and Robotics Engineering department) at Monash University Malaysia. He obtained his PhD in Engineering (Industrial Engineering, Operations Research and Manufacturing) from UTAR on 21 August 2021.
He has more than 17 years of industrial experience in process engineering skills (Polymer and Assembly Semiconductor) and he managed processes such as injection moulding, printing, hot stamping, reflow oven, mounting, sawing, die-attach, oven cure, wire bond, gel coating, and lid attach including MEMS product technology operations.
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​TARGET AUDIENCE
Process Engineers, Manufacturing Engineers, Quality Assurance/Quality Control Engineers, Industrial Engineers, Line/Production Supervisors.

​COURSE CONTENT

• Fundamentals of SPC in Semiconductor Assembly
• Setting Up SPC for New Processes
  
• SPC Application in Die Attach
  
• SPC Application in Wire Bond
• SPC Monitoring During Production
  
• Solving SPC issues in Real-Time: Tools and Methods
  
• Integrated SPC Dashboard and Cross-Process Analysis
  

Terms & Conditions: 
 

• Closing date: one week before the event
• Payment via CASH / CHEQUE / BANK-IN TRANSMISSION / WALK-IN
• FULL PAYMENT must be settled before commencement of the course, otherwise participants will not be allowed to enter the hall. If a place is reserved and the intended participants fail to attend the course, the fee is to be settled in full.
• Fee paid is not refundable. Registration fee includes lecture notes and refreshment.
• IEM Training Academy Sdn Bhd (IEMTA) reserves the right to cancel, alter, or change the program due to unforeseen circumstances. Every effort will be made to inform the registered participants of any changes. In view of the limited places available, intending participants are advised to send their registrations as early as possible so as to avoid disappointment.
• Please be informed that the course will only be carried out if there is sufficient number of participants. The confirmation or cancellation email will be sent to the registered email address one or two weeks before the event dates.

 
Cancellation Policy
 
IEMTA reserves the right to postpone, reschedule, allocate or cancel the course. Full refund less 30% if cancellation is received in writing more than 7 days before the start of the event. No cancellation will be accepted prior to the date of the event. However, replacement or substitute may be made at any time with prior notification and substitute will be charged according to membership status.

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