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 2-Day Course on
FUNDAMENTAL WAFER MOUNTING AND WAFER SAWING PROCESS
(ASSEMBLY SEMICONDUCTOR)
HRD Corp Claimable

​Venue:
WISMA IEM, PETALING JAYA

​Dates: 
27-28 April 2026
​
Time:
9.00 AM to 5.00 PM

Trainer:
IR. TS. DR HO KOK HOE
​
​HRD Corp Claimable:
HRD Corp Serial No: Applying
Approved Duration: Applying

​Registration Fee: 
IEM Member - RM1620.00
Public Registration Fee -  RM1890.00
(Kindly take note that the price is inclusive of SST 8%)
​​
​
​Organised by:
IEM Training Academy Sdn Bhd
(Wholly-owned by The Institution of Engineers Malaysia)

Click to download flyers

OVERVIEW

SYNOPSIS

The "Fundamental Wafer Mounting and Wafer Sawing Process" course provides a comprehensive overview of key processes in semiconductor assembly, focusing on the critical steps of wafer mounting and sawing. Participants will learn the fundamentals of wafer handling, including mounting techniques, adhesive selection, and best practices for achieving optimal die quality. The course will also cover wafer sawing principles, blade selection, and process optimization to minimize chipping, cracking, and yield loss. By integrating theoretical knowledge with hands-on exercises, trainees will gain practical skills to improve wafer integrity and enhance overall manufacturing efficiency in semiconductor assembly.

OBJECTIVE
The objective of this programme is to equip participants with the knowledge and skills to:

1.  Basic process and mechanism of wafer mounting and wafer sawin
2. Correlate the processes to Die Attach/Wire Bond (impact or affect the next process if the quality is compromised
3. Apply and develop SOP and quality control at the processes through investigation analysis
4. Relate Industry 4.0 and Automation to the processes

TARGET AUDIENCE
Managers, Engineers, Technicians & Anyone who is handling wafer mounting and wafer sawing processes
​

TRAINER'S PROFILE

IR. TS. DR HO KOK HOE
Ho Kok Hoe is a senior lecturer (practice) in the School of Engineering (Electrical and Robotics Engineering department) at Monash University Malaysia. He obtained his PhD in Engineering (Industrial Engineering, Operations Research and Manufacturing) from UTAR on 21 August 2021.
He has more than 17 years of industrial experience in process engineering skills (Polymer and Assembly Semiconductor) and he managed processes such as injection moulding, printing, hot stamping, reflow oven, mounting, sawing, die-attach, oven cure, wire bond, gel coating, and lid attach including MEMS product technology operations.

​COURSE CONTENT
​DAY 1
TOPIC 1: Introduction of Wafer Mounting
TOPIC 2: Defect Analysis at Wafer Mount using 5 Whys, Fishbone Tools TOPIC 3: How to conduct Investigation, Control and Write About the Quality Incident Report (Wafer Mount)

DAY 2
TOPIC 1: Introduction of Wafer Sawing
TOPIC 2: Defect Analysis at Wafer Sawing using 5 Whys, Fishbone Tools
TOPIC 3: How to conduct Investigation, Control and Write About the Quality Incident Report (Wafer MountSawing)

Terms & Conditions: 
 

• Closing date: one week before the event
• Payment via CASH / CHEQUE / BANK-IN TRANSMISSION / WALK-IN
• FULL PAYMENT must be settled before commencement of the course, otherwise participants will not be allowed to enter the hall. If a place is reserved and the intended participants fail to attend the course, the fee is to be settled in full.
• Fee paid is not refundable. Registration fee includes lecture notes and refreshment.
• IEM Training Academy Sdn Bhd (IEMTA) reserves the right to cancel, alter, or change the program due to unforeseen circumstances. Every effort will be made to inform the registered participants of any changes. In view of the limited places available, intending participants are advised to send their registrations as early as possible so as to avoid disappointment.
• Please be informed that the course will only be carried out if there is sufficient number of participants. The confirmation or cancellation email will be sent to the registered email address one or two weeks before the event dates.

 
Cancellation Policy
 
IEMTA reserves the right to postpone, reschedule, allocate or cancel the course. Full refund less 30% if cancellation is received in writing more than 7 days before the start of the event. No cancellation will be accepted prior to the date of the event. However, replacement or substitute may be made at any time with prior notification and substitute will be charged according to membership status.

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