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1-DAY COURSE ON
Advanced Wafer Sawing Process (Assembly Semiconductor)
HRD Corp Claimable

​Venue:
WISMA IEM, PETALING JAYA

​Dates: 
29 June 2026 
​
Time:
9.00 AM to 5.00 PM

Trainer:
IR. TS. DR HO KOK HOE
​
​HRD Corp Claimable:
​Approved Duration: APPLYING
HRD Corp Serial No: APPLYING

​Registration Fee: 
IEM Member Fee - RM864.00
Public Registration Fee -  RM 1,080.00​
(Kindly take note that the price is inclusive of SST 8%)
​Organised by:
IEM Training Academy Sdn Bhd
(Wholly-owned by The Institution of Engineers Malaysia)

Click to download flyers

OVERVIEW

SYNOPSIS

The "Advanced Wafer Sawing Process" course delves into the intricacies of cutting-edge techniques and technologies used in semiconductor wafer sawing. This program is designed for professionals seeking to enhance their understanding of advanced sawing methodologies, including precision cutting, optimized blade selection, and innovative cooling techniques. Participants will explore key topics such as stress management, minimizing kerf loss, and improving yield rates while maintaining high-quality die integrity. Through a combination of theoretical instruction and hands-on practice, attendees will develop the skills necessary to tackle complex sawing challenges, adopt best practices, and implement process improvements that drive efficiency and reliability in semiconductor assembly.

OBJECTIVE
The objective of the "Advanced Wafer Sawing Process" training course is to equip participants with an in-depth understanding of advanced techniques and methodologies in semiconductor wafer sawing. By the end of the course, attendees will be able to analyze and implement optimized sawing processes, select appropriate blades and cooling strategies, manage stress and kerf loss effectively, and enhance die quality and yield rates in semiconductor assembly. This knowledge will enable participants to address complex sawing challenges and drive continuous improvement in their manufacturing operations.



​

TRAINER'S PROFILE

IR. TS. DR HO KOK HOE
Ho Kok Hoe is a senior lecturer (practice) in the School of Engineering (Electrical and Robotics Engineering department) at Monash University Malaysia. He obtained his PhD in Engineering (Industrial Engineering, Operations Research and Manufacturing) from UTAR on 21 August 2021. He has more than 17 years of industrial experience in process engineering skills (Polymer and Assembly Semiconductor) and he managed processes such as injection moulding, printing, hot stamping, reflow oven, mounting, sawing, die-attach, oven cure, wire bond, gel coating, and lid attach including MEMS product technology operations.

​COURSE CONTENT​

• Relationship of the process with Yield Improvement, SPC, Tool Life
• Process and Machine Operations
• Technical/ Product Development on Sawing Process
• Process Optimization and Characterization
• Advanced Defect Analysis, Impact to next process, Propose Solution
• Case Studies: Process Optimization and Characterization

​TARGET AUDIENCE

• Engineers
• Managers
• Technicians
• Anyone who is handling wafer sawing processes

Terms & Conditions: 
 

• Closing date: one week before the event
• Payment via CASH / CHEQUE / BANK-IN TRANSMISSION / WALK-IN
• FULL PAYMENT must be settled before commencement of the course, otherwise participants will not be allowed to enter the hall. If a place is reserved and the intended participants fail to attend the course, the fee is to be settled in full.
• Fee paid is not refundable. Registration fee includes lecture notes and refreshment.
• IEM Training Academy Sdn Bhd (IEMTA) reserves the right to cancel, alter, or change the program due to unforeseen circumstances. Every effort will be made to inform the registered participants of any changes. In view of the limited places available, intending participants are advised to send their registrations as early as possible so as to avoid disappointment.
• Please be informed that the course will only be carried out if there is sufficient number of participants. The confirmation or cancellation email will be sent to the registered email address one or two weeks before the event dates.

 
Cancellation Policy
 
IEMTA reserves the right to postpone, reschedule, allocate or cancel the course. Full refund less 30% if cancellation is received in writing more than 7 days before the start of the event. No cancellation will be accepted prior to the date of the event. However, replacement or substitute may be made at any time with prior notification and substitute will be charged according to membership status.

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